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  • Exmel Solutions Ltd
  • 1A South Caldeen Road
  • Coatbridge
  • North Lanarkshire
  • ML5 4EG
  • Tel: 01698 745058
  • Fax: 01698 749684
  • Email: sales@exmel.co.uk

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J8 No Clean Jetting Solder Paste

J8 No Clean Jetting Solder Paste

Product Code:

AIM’s J8 No Clean Jetting Solder Paste is specially formulated for use with jetting equipment providing consistent solder deposits as small as 200μm. J8 is fully compatible with all AIM no clean solder pastes for use in applications where combining jetted paste deposits with printed paste deposits is required. J8 has a novel activator system providing powerful, durable wetting action accommodating a wide range of profiling producing bright shiny joints without graping defects. J8 has reduced voiding to as low as <5% on BGA and <10% on BTC ground pads.

- Capable of 200μm deposits
- Low Voiding: <5% on BGA and <10% on BTC Components
- Eliminates HiP Defects
- REACH and RoHS Compliant (Lead-Free)
- Powerful Wetting on Lead-Free Surface Finishes
- Passes Bono Testing
- Available in SAC305 and Sn63 Alloys

For more information on any of our products, do not hesitate to call us on 01698 745058 or email our sales department at sales@exmel.co.uk, quoting the Product Code if one is listed.