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  • Exmel Solutions Ltd
  • 1A South Caldeen Road
  • Coatbridge
  • North Lanarkshire
  • ML5 4EG
  • Tel: 01698 745058
  • Fax: 01698 749684
  • Email: sales@exmel.co.uk

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Underfill FF35

Underfill FF35

Product Code:

Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underfill FF35 offers superior reliability through high Tg, low CTE, good fill, no voiding, compatibility with no-clean flux residues and excellent adhesion. Faster throughput and higher yields are achieved through excellent capillary action, faster flow characteristics and rapid cure speeds. Underfill FF35 may be reworked at 120°C (250°F). The viscosity of Underfill FF35 remains stable throughout its shelf life. This product is suitable for bare chip protection in a broad variety of small die applications.

Features:
- Excellent Capillary Function for Fast Reflow
- Compatible with No-Clean Flux Residues
- Reworkable at 120° C
- Good Storage Properties
- No Voiding
* Non-REACH Compliant

For more information on any of our products, do not hesitate to call us on 01698 745058 or email our sales department at sales@exmel.co.uk, quoting the Product Code if one is listed.